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Kexiang to Invest 2 Billion Yuan in AI Computing PCB Substrate Project

Kexiang Co. plans to invest about 2 billion yuan ($280 million) to build a high-end AI computing PCB substrate project in the Xiangshuihe Industrial Park in Daya Bay, Huizhou, with a two-year construction period. Once completed, the project will add annual capacity of 46,000 square meters of mSAP substrates and 1.2 million square meters of AI server PCB substrates.

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AI take

The scale of this commitment — roughly $280 million and a two-year build — signals that substrate capacity for AI servers is being planned well ahead of demand visibility, which matters because mSAP substrate supply has been a genuine bottleneck in high-end compute hardware. The move affects the upstream materials and equipment ecosystem around Huizhou as much as Kexiang itself, since a project this size pulls in suppliers and local industrial-park infrastructure. The open question is timing: capacity arriving after a two-year construction period will meet whatever the AI server cycle looks like then, not today's order book.

Generated by AI for reference only.

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