TREE NEWS reports: Investment-grade technology borrowers’ average bond funding costs have surged to their highest level relative to the rest of the US market since 2003. With bond supply expanding sharply, tech credit spreads could widen further from current three-year highs while spreads on high-grade bonds overall remain subdued, further inflating the AI risk premium.
Tech Bond Funding Costs Hit Highest Since 2003 Relative to US Market
The signal here is relative, not absolute: high-grade spreads broadly remain subdued, so the widening is a tech-specific repricing rather than a market-wide stress event. That distinction matters most for AI-linked issuers and their lenders, since it suggests investors are differentiating on sector exposure and supply absorption rather than fleeing credit outright. Whether the tech premium keeps expanding while the rest of the high-grade market stays calm is the open question — a divergence that would mark this as a durable repricing rather than a supply-driven blip.
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