TREE NEWS update: JCET Group announced a private placement of A-shares to raise up to 6.5 billion yuan. Proceeds will fund expansion of high-performance computing advanced packaging, high-end power module testing, wafer-level packaging upgrades, and high-density memory system-level packaging, plus working capital and loan repayment.
JCET Plans up to 6.5B Yuan Private Placement for Packaging Expansion
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