Biwin Storage board approves ~RMB4.5B phase-three advanced packaging project

The board's ability to commit this scale of capital without shareholder approval signals how routine advanced packaging capacity has become for Chinese memory players — and how directly the storage supply chain now feeds AI-adjacent demand. The choice of Songshan Lake places the expansion inside Dongguan's existing electronics cluster, where equipment, substrate and test capacity already sit. The open question is execution: wafer-level packaging is capital-intensive and yield-sensitive, and whether the phase-three line ramps on schedule will matter more to the broader packaging market than the headline figure itself.