TREE NEWS reports: Goldman Sachs said high-bandwidth flash (HBF) and other new NAND technologies could ease the AI “memory wall” and cut AI infrastructure costs, with a potential market of $40 billion to $150 billion assuming GPU adoption of 15% to 50%. The bank maintained Buy ratings on SanDisk and SK Hynix for their HBF lead, said Samsung Electronics should also benefit, and kept Micron at Neutral given its DRAM and HBM focus.
Goldman Sachs: HBF Could Break AI ‘Memory Wall’ With Up to $150B Market
The interesting signal here is not the headline number but the implied shift in where value accrues inside the AI stack: if flash can absorb part of the memory burden, the bottleneck moves away from DRAM and HBM, which is precisely why Goldman's rating split falls where it does. That distinction matters most for memory makers whose roadmaps are concentrated in one camp rather than spanning both. The open question is whether GPU-level adoption of HBF actually materializes at the low end of that range or the high end, since the market sizing is entirely contingent on it.
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