TREE NEWS update: Xinqi Micro Equipment chairman Cheng Zhuo said at the company’s 2026 half-year results briefing that high-end PCB equipment order deliveries will remain full in the second half, with advanced packaging equipment entering verification and deployment. He added that AI servers, related substrates and advanced packaging capacity expansion will bring further equipment demand next year. The company’s second-phase plant ran at high utilization during its first-half ramp-up and will enter full release in the second half.
Xinqi Micro Equipment Says High-End PCB Orders Stay Full in H2
The signal here is less about Xinqi itself than about the capex pipeline feeding AI hardware: a domestic equipment supplier describing full high-end PCB order books and advanced packaging tools moving into verification suggests capacity expansion is still being funded rather than deferred. That matters for substrate and packaging supply chains, where equipment lead times often precede visible output. The open question is whether the demand the chairman attributes to AI servers next year converts into orders, or stays an expectation.
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