TREE NEWS reports: Samsung Electronics is expected to at least double its HBM4 and HBM4E production next year from 2025 levels, analyst jukan of Citrini wrote on X. The company plans to raise outsourced cleaning of glass carriers used in HBM production from 20,000 wafers a month this year to 50,000 a month next year. Samsung began mass shipping HBM4 in February and in May provided 12-layer HBM4E samples to customers including Nvidia.
Samsung to at least double HBM4 and HBM4E output next year, analyst says
AI take
The outsourcing detail is the real signal: cleaning capacity is a precursor to volume, not a trailing indicator, so the ramp is being planned upstream of final assembly. That matters for the HBM supply chain and for Samsung's standing against rivals in the high-bandwidth memory race. Whether the cited production targets hold, and whether HBM4E qualification with Nvidia converts into orders, is the open question.
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