Benchuan Smart plans up to 1B yuan high-end PCB project

This capital commitment signals a bet on sustained demand for advanced interconnect substrates, particularly HDI and high-layer boards, which are central to AI-driven hardware and high-performance electronics. The scale—up to 1 billion yuan—and the focus on any-layer HDI suggest a strategic push up the value chain rather than commodity PCB output. For the broader RWA/crypto markets, the relevance is indirect but tangible: such manufacturing expansions often mirror expectations of rising compute infrastructure needs. The open question is whether shareholder approval and execution pace align with demand cycles, and whether this capacity addition pressures pricing in the high-end segment.