TREE NEWS reports: Nvidia has asked Samsung Electronics, SK Hynix and Micron to produce its custom NVHBM memory using base dies made on TSMC’s 3nm process, with core dies on sixth-generation DRAM, and Samsung has decided to accept the technical requirements. Samsung said on Oct. 19 that it does not comment on customer-related matters.
Nvidia Taps TSMC 3nm Base Die for Custom NVHBM, Samsung Agrees
The notable signal here is architectural rather than commercial: Nvidia is reportedly steering the logic layer of its custom HBM to a foundry outside the memory makers' own process roadmaps, which would deepen TSMC's position in the AI memory stack even as Samsung, SK Hynix and Micron supply the DRAM. Samsung's willingness to accept those terms suggests memory vendors are conceding some design control to secure Nvidia's custom HBM business. Whether the other two suppliers follow, and how this reshapes foundry-versus-memory-maker leverage, is the open question worth watching.
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