TREE NEWS update: SK Hynix has expanded its outsourced flip-chip packaging of memory semiconductors, adding WINPAC as an OSAT partner after A-PROTECH. WINPAC has completed equipment installation at its P Campus packaging plant and started mass production of DDR4 and DDR5 DRAM. The P Campus line handles DRAM, NAND Flash and eUFS packaging, and recently raised monthly capacity from 44 million to 50 million units.
SK Hynix Outsources DRAM Packaging to WINPAC After Four Years
AI take
SK Hynix widening its OSAT roster beyond A-PROTECH points to a structural shift: leading memory makers are increasingly willing to let external partners handle advanced packaging, not just legacy work. WINPAC's P Campus line already spans DRAM, NAND Flash and eUFS, so the added DRAM volume slots into an existing footprint rather than a dedicated bet. The open question is whether this outsourcing deepens as packaging becomes a genuine performance differentiator, or stays a capacity-release valve for mature nodes.
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