TREE NEWS update: SanDisk’s high-bandwidth flash (HBF) achieved its first memory chip tape-out in the first fiscal quarter, Chairman and CEO David Goeckeler said on the company’s analyst call. HBF is designed to complement HBM by bringing NAND-class capacity closer to processors, and samples are planned for delivery in the next calendar year. The company also said BiCS 8 is the mainstay of current production, with BiCS 9 and BiCS 10 in development.
SanDisk CEO: HBF memory chip tapes out in fiscal Q1, samples planned next year
AI take
The tape-out matters less as a milestone than as a signal that NAND is being positioned to share the memory tier closest to processors, a space HBM has held alone. That puts SanDisk in a longer-horizon conversation with the HBM supply chain rather than a direct competitor, and the multi-node BiCS roadmap suggests capacity scaling is the real constraint. Whether sampling stays on the stated timeline, and how HBF is received by accelerator designers weighing it against HBM, is the open question worth watching.
Generated by AI for reference only.
Share on WeChat
Open WeChat → Scan → then tap "…" to send to a chat or Moments.
Tap "…" in the top-right corner to send to a chat or share to Moments.
Related News
3h ago
Anthropic Expected to Land High-Yield Junk Rating After US IPO
3h ago
Blackstone tells investors Anthropic may miss investment-grade rating post-IPO
4h ago
AWS CEO Matt Garman Says Amazon Seeking Responsible Funding for Massive AI Opportunity
4h ago
Amazon Sets Up $80 Billion Supplier Loan Facility to Fund AI Hardware
4h ago
OpenAI to Publish First Report in Early 2027
4h ago
ECB Chief Economist Lane Says AI’s Impact on Inflation Is Limited