TREE NEWS update: UBS analysts believe China will struggle to develop competitive extreme ultraviolet (EUV) lithography equipment rivaling ASML’s within the next decade, while deep ultraviolet (DUV) tools could reach mass production in two to five years. This highlights the ongoing tech gap in semiconductor manufacturing.
UBS: China unlikely to match ASML EUV in decade, DUV mass production may take 2-5 years
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