TSMC Reportedly Spends $300M+ on AUO Plants for CPU Ecosystem

The notable signal is vertical scope, not capacity: a pure-play foundry tying up panel-maker sites suggests the CPU ecosystem push is being built around packaging, substrate or advanced integration steps that sit outside standard wafer fabrication. That matters most to advanced-packaging suppliers and to customers weighing how much of the back-end stack a single vendor controls. Whether this reflects a durable strategy or opportunistic real estate is the open question.