ASE Tech Secures Additional Advanced Packaging Orders from Google TPU and Intel

This order expansion signals that advanced packaging capacity is becoming a strategic bottleneck for AI compute, not just a manufacturing step. The fact that both Google and Intel are turning to ASE suggests a widening reliance on outsourced assembly as chip designers scale custom silicon. For the supply chain, the key question is whether ASE can ramp capacity fast enough to meet demand without creating a new constraint point. Watch how this affects the competitive balance between pure-play foundries and OSAT providers, as advanced packaging increasingly dictates who can deliver AI chips at scale.