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Huawei unveils Kirin 9050 Pro chip with logic-folding tech

Huawei launched the Mate XT 2 trifold phone in Guangzhou on the 7th, debuting the Kirin 9050 Pro chip, the first high-performance chip using logic-folding technology. The chip stacks logic layers vertically with interconnects, reducing signal latency. It marks Huawei’s first new Kirin chip at a flagship event in six years, since the Mate 40 launch.

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