Press Enter to search · ESC to close

Macro

ASML, TSMC Launch Initiative for 12-Inch Photomask Transition

ASML and TSMC announced a joint industry initiative to drive the transition to 12-inch photomasks, maximizing the value of High NA EUV lithography. The initiative aims to establish a pilot production line for 12-inch photomasks by 2031 and achieve full lithography readiness for advanced nodes by 2033. Multiple High NA EUV adopters and key suppliers have expressed intent to join.

Original source

Share

Related News

TREE NEWS share card
Long-press image above → Save to Photos / Share
Pitch us Feedback