CIOE 2025: Firms Debut 200G Optical Chips, 6.4T CPO Engines

The breadth of launches—from 200G single-wavelength chips to 6.4T co-packaged optics engines—signals that suppliers are converging on higher per-lane speeds and tighter integration as the next competitive frontier in optical interconnect. That matters for data-center operators and equipment vendors whose roadmaps depend on whether these components move from exhibition demos to volume production. The open question is whether the CPO ecosystem can mature fast enough to justify the switching costs for hyperscalers.