Samsung opens advanced chip packaging R&D center in Japan

TREE NEWS update: Samsung Electronics has opened an advanced semiconductor packaging R&D center in Yokohama, Japan, as part of a five-year plan announced in 2024 to invest about 40 billion yen in expanding research infrastructure and strengthening advanced packaging technology. The Advanced Package Lab will collaborate with Japanese companies, universities, and research institutes to develop next-generation packaging materials and processes. Samsung aims to staff the center with over 100 researchers by 2027.