Huawei’s He Tingbo Publishes Paper Defending 3D Chip Stacking

TREE NEWS update: Huawei semiconductor chief He Tingbo on Sept. 4 published a paper on ChinaXiv, titled “Huawei’s τ Chip Was Supposed to Melt?”, addressing doubts over 3D-stacked chips’ heat issues. Using Kirin 2026 test data, she argues that stacking more transistors can actually make chips cooler, countering industry skepticism about high power density and heat.